Qlx3gx: Ultra-low-power Gnss

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Qualinx will present its production-ready 1 mW QLX3Gx Series Gnss chip built around a dynamically reconfigurable design, together with a Developer Evaluation Kit (Evk), at Embedded World 2026 in Nuremberg, March 10–12. A Gnss chip is an integrated circuit that receives and processes signals from multiple global navigation satellite systems to determine geographic location; Gnss includes systems such as Gps, Galileo, Glonass, and BeiDou. Gps is the United States’ Global Positioning System (a specific satellite navigation system), while Gnss is the broader term for all such systems—so all Gps devices are Gnss devices, but not all Gnss devices are limited to Gps.
The QLX3Gx Evk lets Oem teams verify power-versus-performance leadership and integration readiness directly in device-class conditions across IoT, Uav platforms, wearables, asset tracking, mobility, and infrastructure. Additional showcases feature low-power navigation and integration demonstrations.
1 mW Gnss: Driven by Dragonfly
At the heart of the QLX3Gx, Qualinx’s patented Dragonfly Digital Radio Frequency (Drf) shifts traditionally analog Rf functions into the digital domain, restoring Moore’s Law scaling for radios and slashing power consumption without sacrificing performance.
Designed for volume from day one, the highly integrated device pairs an ultra-low-power digital Rf front end with an advanced Gnss baseband engine, making it ready for high-volume manufacturing and Oem deployment.
Dragonfly also enables dynamic over-the-air reconfiguration throughout the product lifetime, trimming supply chain complexity and cost while unlocking new waves of downstream product innovation from a single chip.
Built on a European Gnss architecture offering versatile power-to-performance options, hardware-level security, and resilience, positioning is executed natively on chip instead of in the cloud, increasing resistance to spoofing, jamming, and interference.
Live Demonstrations: What’s on Show
On-site sessions at Embedded World 2026 underscore performance and agility, advancing the strategy to redefine connectivity by bringing secure, reconfigurable, and exceptionally efficient navigation to scale.QLX3Gx Developer Evaluation Kit (Evk): Hands-on verification of real-world energy use, reconfigurability, and integration maturity.1 mW Navigation With Dragonfly Digital Rf: A 1 mW mode shrinks one of the biggest energy drains in connected systems, enabling longer battery life, smaller designs, and a reduced carbon footprint.Qualinx Transmit: A single chip enabling beacon-to-beacon collaboration demonstrates devices coordinating as an intelligent swarm, accelerating ambient IoT scenarios.Galileo Osnma Authentication With Euspa: With more than 4 billion devices tied to Galileo, on-chip navigation message authentication raises spoofing protection while aligning with Europe’s sovereign Galileo infrastructure.QLX3AX Analog Front End (Afe): A dynamically over-the-air-reconfigurable Afe supports multiple radio technologies for specialized receivers and custom systems.Wearable Integration Display: Smartwatch-class readiness confirms compact footprint and suitability for IoT and wearable devices.
Availability of the QLX3Gx Gnss chip and Evk follows a recently announced €20 million investment to fuel Qualinx’s growth and international expansion. As governments and enterprises reevaluate risk in globally concentrated semiconductor supply chains, the company stands out as a European semiconductor company combining European Ip and manufacturing with hardware-level security for resilient, low-power connectivity without cloud dependency.
Every Qualinx product, including the QLX3Gx Gnss chip, is designed and built in Europe, keeping production within the Eu and lowering supply-chain exposure.
Oems are invited to register interest via info@ in the developer Evk at Embedded World, from 10–12 March at the Exhibition Centre Nuremberg, Hall 3, Booth 2211, to secure hands-on evaluation of the QLX3Gx for upcoming consumer, industrial, and mobility applications ahead of mass production this year. For media interviews, contact media@ .















